| Product Type | Product Features | application area |
| Resin LXPI-2501 for polyimide molding plastics | Soften the resin by heating, fill it into the mold, and cool it to form. Suitable for high filling materials or complex structures, with a long molding cycle requiring high temperature (300-400 ° C) and high pressure. Especially suitable for applications that require large structures. | Commonly used in the manufacturing of large plastic products such as high-temperature resistant home appliance casings, automotive components, high-temperature resistant seals, bearings, aviation structural components, etc. |
| Resin LXPI-2601 for polyimide laminates | Soak polyimide resin in glass fiber/carbon fiber substrate, and then heat press cure to form a laminated board. Suitable for plates or composite structures with high heat resistance, excellent mechanical properties, and good insulation. | Low altitude flight, printed circuit board substrate, high-temperature insulation gasket, aerospace, military composite materials. |
| Resin LXPI-2701 for polyimide injection molding | Inject molten polyimide resin into the mold and rapidly cool it to form. The material has good fluidity, high efficiency, and is suitable for large-scale production | Widely used in the manufacturing of small precision products such as plastic parts and packaging materials, electronic connectors, micro precision parts, automotive heat-resistant components, etc. |
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