| Product Type | Product Features | application area |
| Universal Base Adhesive LXPI-3001 | Adhesive to polymer substrates, inorganic substrates, and metal substrates, with high flexibility, excellent compatibility with different material interfaces, and good adhesion | Polymer substrate: Flexible Printed Circuit (FPC), OLED display module packaging, composite film lamination. Inorganic substrates: MEMS sensor packaging, high-temperature ceramic substrate bonding, photovoltaic backplate sealing. Metal substrate: High temperature resistant coating for aircraft engines, fixing of semiconductor lead frames, bonding of heat dissipation structures for 5G RF devices |
| Silicon carbon negative electrode adhesive LXPI-3101 | High adhesion stability, high temperature resistance, electrolyte compatibility, efficient ion/electron transport | High energy density lithium-ion batteries, solid-state battery systems, flexible consumer electronic devices, etc |
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