Microelectronic polyimide coating LXPI-1601

The passivation layer and buffer protection layer

 used in microelectronic devices can effectively

 block electron migration, prevent corrosion, 

and increase the mechanical performance and 

moisture resistance of the device.

Chip manufacturing, circuit board protection, 

silicon wafer glass substrate coating,

 microelectronic packaging, sensor 

protection for microelectromechanical systems.